High Bump 晶圆减薄膜

  产品特点：

• 对大直径大球晶圆有优良的包裹性，不易造成表面凹陷

 (Dimple) BG tape prevents from Dimpples and wafer damawith itls high confomity to bumped wafers of a large diarete

• 易剥离设计，胶带在剥离时降低大球破损及残胶的风险

  No adhesive residue and wafer damages by a special designior efficient and easy peel

• 使用PET基材，能有效抑制晶圆的翘曲

  PET backing materials to prevent wafer warpage